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Several themes caught our attention on Day 2 of DAC 2023: digital twins, curvy design and chiplets. In addition, there was continued focus on collaboration, innovation, ecosystems and talent—as part of the semiconductor industry’s path to becoming a trillion-dollar market, its path to net zero, and its path to getting a million skilled workers in engineering by 2030 to address the talent shortage.
In EE Times’ video report, you’ll hear about the keynotes from Ansys, on engineering simulation and design, and from IBM, on the quantum computing roadmap. Nitin Dahad also reflects on his engaging panel discussion—with execs from Ansys, Instrumental, Nvidia and Siemens EDA—concerning designing effective autonomous systems and digital twins.
Also included is mention of the collaboration between Applied Materials and Arizona State University that’s supported by a $270 million public-private partnership and will result in a materials-to-fab center at ASU’s research park. And, you’ll hear a bit about Applied Materials’ new Vistara wafer-manufacturing system.
Sally Ward-Foxton reports on the curvy design, discussed in a panel with executives from D2S, Micron, Perceive and the University of California, San Diego.
She also reflects on her chat with Verifai.
Dahad also reports on briefings with Intel Foundry Services, which demonstrated its PADK (packaging assembly design kit)—and which has certified EDA vendors Anysys, Cadence, Siemens EDA and Synopsys on the Intel 16 process
He also shares what he learned from Cadence about the challenge of 3D IC design and chiplet creation flows.
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