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What is a harsh environment?
A harsh environment typically includes conditions of extreme temperature, including both intense heat and severe cold, which can cause difficulties for human endurance. When considering power supply, a harsh environment can be characterized as an environment where the power supply might encounter factors like heat, moisture, cosmic rays, and vibration. Effectively managing thermal conditions consistently presents a prevalent challenge for power supplies operating in such challenging environments.
Major cooling techniques for power supplies:
There are three main methods for cooling power supplies:
Natural convection:
When a power supply is heated, the surrounding fluid (like air) becomes warmer and less dense. This causes the fluid to rise, like a hot air balloon. As the fluid rises, cooler fluid from the surroundings flows in to replace it. This creates a natural circulation pattern that helps to cool the power supply.
Forced air cooling:
Forced convection is a method of heat transfer that uses mechanical devices, such as fans, to move the fluid over the surface of a power supply. This enhances the natural convection process, which is the movement of fluid due to differences in temperature. The increased movement of fluid helps to transfer heat away from the power supply more quickly, which helps to prevent it from overheating.
Conduction cooling:
Conduction cooling is a way of heat transfer that occurs when two objects at different temperatures are in direct contact with each other. The heat from the hotter object is transferred to the cooler object (metal case) through molecular interactions, without the involvement of fluid motion.
From the table above, it can be seen that conducted cooling would be the most cost-effective and reliable solution, making it ideal for use in harsh environments.
How can a fanless power supply be designed?
Traditionally, industrial power supplies have used on-board heatsinks or U-channel chassis to dissipate heat. This basic structure is shown in Fig.1. However, this method of heat dissipation is not always effective, as the majority of the heat still remains in the power supply or system. This can have a significant impact on overall system reliability and over-temperature protection.
The solution to this problem is to effectively transfer the heat source to the outside of the system. The heat generated by power supply mainly comes from critical components such as power devices, magnetics, and capacitors. By mounting these components directly onto a metal base (baseplate) and attaching them to the metal case of the system, heat can be successfully delivered to the outside. The following Fig.2 shows one of the examples and how the concept works.
To transfer heat from power supplies to the outside of the system, mount the critical components (such as power devices, magnetics, and capacitors) directly onto a metal base (baseplate) and attach it to the metal case of the system. This will allow the heat to be successfully delivered to the outside. Fig.2 shows one of the examples and how the idea works.
The CFM500S series uses baseplate cooling to dissipate heat. Users can add an extra metal plate with dimensions of 480mm * 248mm * 1.2mm under the baseplate to further enhance the heat dissipation performance. Please refer to the photos below for installation instructions and more details can be found in the official application note.
The CFM500S series can deliver 500W (full load) without a fan when used with the baseplate cooling solution. The power derating curve is shown below:
Conclusion
Cincon’s AC-DC fanless power solution, available in open-frame, cover, and brick types, suits diverse systems, offering 70W to 750W power range. The baseplate cooling technology enhances power density and heat dissipation performance in fanless and high-temperature conditions, making Cincon the ideal choice for these features.
Check the product portfolio and contact sales@cincon.com.tw for more support.
ITE/Industrial Fanless Power Supply:
Medical Fanless Power Supply:
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